Flexible and printed electronics are making headway in a number of fields, including automotive, healthcare, sensors, wearables and much more. Printed Electronics USA 2019, will be held Nov. 20-21 at the Santa Clara Convention Center, Santa Clara, CA, will be showcasing examples of commercialization as well as areas where these technologies are picking up interest.

Part of the IDTechEx Show!, Printed Electronics USA 2019 will be held Nov. 20-21 at the Santa Clara Convention Center, Santa Clara, CA. In addition to Printed Electronics USA 2019, there will be seven co-located programs, including Graphene, Sensors,  Internet of Things, Wearables, Electric Vehicles, and Energy Storage.

IDTechEx CEO Raghu Das is expecting the event to do very well.

“We have a record number of speakers – 288 coming from 26 countries, and expect to exceed 3,500 attendees,” Das said.
 
“We have a large number of brands presenting on the use cases and activities in printed electronics,” Das added. “They include GM, Faurecia, Airbus, Osram, Geely, Schreiner Medipharm, AbinBev, UTRC and many more.”

Das said that the continuous growth of IDTechEx’s PE conferences reflects the expanding opportunities for printed and flexible electronics.

“It shows the continuing commercial interest and adoption in the industry,” he said. “Uniquely our event is focused on the application of these technologies and helping companies find the value for printed electronics by bringing vendors together with OEMs and users.”

The conference will begin with a welcome and introduction by Das. He will be followed by Dr. Gayatri Dadheech, senior technical leader for General Motors, who will cover “Opportunities In The Automotive Industry: From Materials To Printed Electronics To Electric Vehicles.”

Next up will be Tamim Belhaj, product line director at Faurecia, who will focus on “The HMI Evolution in Vehicles.” Myant president Tony Chahine will close the Cornerstone session with “Human Connectedness: Re-imagined.”

After the Cornerstone, the conference will break out into eight concurrent sessions. There will be presentations from a wide range of companies, including Airbus Operations GmbH, Osram, LG Electronics, GE Global Research, Bosch Sensortec, Cisco IoT, Dell Technologies, BMW, Aston Martin, DuPont, Microsoft, Flex and more.

Das pointed to a number of interesting highlights for this year’s conference.

“There are several key themes: one is the new human-machine interface opportunities, thanks to flexible, stretchable and 3D electronics,” he said. “The event is also focused on new product design, bringing together leading OEMs to see what is available and becoming available that they can use to differentiate their products.

“Healthcare is a very strong theme this year too, with sessions on electronic skin patches to innovations in biosensors,” added Das. “Flexible hybrid electronics is another strong theme and we cover the whole process and options at this event, with a new masterclass also dedicated to that topic.”

Das said that the co-located programs allow attendees and exhibitors to see opportunities to mesh with other technologies

“It brings together relevant user industries with printed electronics,” he observed. “For example, in vehicles, there are many needs from printed electronics, from in-mold electronics to die attach pastes for power semiconductors in electric vehicles to user comfort. In wearables, printed electronics enables flexible and stretchable electronic skin patches and other relevant systems. Those in printed electronics can meet large OEMs across many verticals with the aim of accelerating their time to market.”

For more information, see www.idtechex.com/usa2019/show/en/.